4 GB
HBM1000 MHz
Boost Clock350 W
TDP28 nm
ProcessShare on Social Media
Share Radeon Pro Duo specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 3.0
Process Size:
28 nm
Base Clock:
1000 MHz
Boost Clock:
1000 MHz
Shader Units:
4096
TMUs:
256
ROPs:
64
Memory & Performance
Memory Size:
4 GB
Memory Type:
HBM
Memory Bandwidth:
512.0 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
350 W
Suggested PSU:
750 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
2.0 MB
Die Size:
596 mm²
Transistors:
8.9 billion
Transistor Density:
14.9 million/mm²
Physical Specifications
Board Length:
277 mm
Board Width:
111 mm
Power Connectors:
3x 8-pin
Display Outputs:
1x HDMI 1.4a, 3x DisplayPort 1.2
Quick Facts
Performance
Pixel Fill Rate
64.0 GPixel/s
Texture Fill Rate
256.0 GTexel/s
FP32 Performance
8.2 TFLOPS