8 GB
HBM21500 MHz
Boost Clock230 W
TDP14 nm
ProcessShare on Social Media
Share Radeon Pro WX 8200 specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 5.0
Process Size:
14 nm
Base Clock:
1200 MHz
Boost Clock:
1500 MHz
Shader Units:
3584
TMUs:
224
ROPs:
64
Memory & Performance
Memory Size:
8 GB
Memory Type:
HBM2
Memory Bandwidth:
512.0 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
230 W
Suggested PSU:
550 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
4.0 MB
Die Size:
495 mm²
Transistors:
12.5 billion
Transistor Density:
25.3 million/mm²
Physical Specifications
Board Length:
267 mm
Board Width:
111 mm
Power Connectors:
1x 6-pin + 1x 8-pin
Display Outputs:
4x mini-DisplayPort 1.4a
Quick Facts
Performance
Pixel Fill Rate
96.0 GPixel/s
Texture Fill Rate
336.0 GTexel/s
FP32 Performance
10.8 TFLOPS