600 MHz
Boost Clock15 W
TDP28 nm
ProcessShare on Social Media
Share Radeon R2 Mobile Graphics specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 3.0
Process Size:
28 nm
Base Clock:
200 MHz
Boost Clock:
600 MHz
Shader Units:
128
TMUs:
8
ROPs:
4
Memory & Performance
Memory Type:
System Shared
Bus Interface:
IGP
TDP:
15 W
Cache & Die Information
Die Size:
125 mm²
Transistors:
1.2 billion
Transistor Density:
9.6 million/mm²
Physical Specifications
Power Connectors:
None
Quick Facts
Performance
Pixel Fill Rate
2.4 GPixel/s
Texture Fill Rate
4.8 GTexel/s
FP32 Performance
0.2 TFLOPS