758 MHz
Boost Clock15 W
TDP28 nm
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Core Specifications
Architecture:
GCN 3.0
Process Size:
28 nm
Base Clock:
200 MHz
Boost Clock:
758 MHz
Shader Units:
384
TMUs:
24
ROPs:
8
Memory & Performance
Memory Type:
System Shared
Bus Interface:
IGP
TDP:
15 W
Cache & Die Information
Die Size:
125 mm²
Transistors:
1.2 billion
Transistor Density:
9.6 million/mm²
Quick Facts
Performance
Pixel Fill Rate
6.1 GPixel/s
Texture Fill Rate
18.2 GTexel/s
FP32 Performance
0.6 TFLOPS