8 GB
HBM21677 MHz
Boost Clock345 W
TDP14 nm
ProcessShare on Social Media
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Core Specifications
Architecture:
GCN 5.0
Process Size:
14 nm
Base Clock:
1406 MHz
Boost Clock:
1677 MHz
Shader Units:
4096
TMUs:
256
ROPs:
64
Memory & Performance
Memory Size:
8 GB
Memory Type:
HBM2
Memory Bandwidth:
483.8 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
345 W
Suggested PSU:
700 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
4.0 MB
Die Size:
495 mm²
Transistors:
12.5 billion
Transistor Density:
25.3 million/mm²
Physical Specifications
Board Length:
272 mm
Board Width:
112 mm
Power Connectors:
2x 8-pin
Display Outputs:
1x HDMI 2.0b, 3x DisplayPort 1.4a
Quick Facts
Performance
Pixel Fill Rate
107.3 GPixel/s
Texture Fill Rate
429.3 GTexel/s
FP32 Performance
13.7 TFLOPS