1200 MHz
Boost Clock10 W
TDP12 nm
ProcessShare on Social Media
Share Radeon Vega 3 Embedded specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 5.0
Process Size:
12 nm
Base Clock:
300 MHz
Boost Clock:
1200 MHz
Shader Units:
192
TMUs:
12
ROPs:
4
Memory & Performance
Memory Type:
System Shared
Bus Interface:
IGP
TDP:
10 W
Cache & Die Information
Die Size:
210 mm²
Transistors:
4.9 billion
Transistor Density:
23.5 million/mm²
Physical Specifications
Power Connectors:
None
Quick Facts
Performance
Pixel Fill Rate
4.8 GPixel/s
Texture Fill Rate
14.4 GTexel/s
FP32 Performance
0.5 TFLOPS