256 MB
GDDR3600 MHz
Boost Clock44 W
TDP80 nm
ProcessShare on Social Media
Share Radeon X1650 PRO AGP specifications with othersTechnical Specifications
Core Specifications
Architecture:
Ultra-Threaded SE
Process Size:
80 nm
Base Clock:
600 MHz
Boost Clock:
600 MHz
TMUs:
4
ROPs:
4
Memory & Performance
Memory Size:
256 MB
Memory Type:
GDDR3
Memory Bandwidth:
22.4 GB/s
Bus Interface:
AGP 8x
TDP:
44 W
Suggested PSU:
200 W
Cache & Die Information
Die Size:
131 mm²
Transistors:
0.2 billion
Transistor Density:
1.2 million/mm²
Physical Specifications
Power Connectors:
1x Molex
Display Outputs:
2x DVI, 1x S-Video
Quick Facts
Performance
Pixel Fill Rate
2.4 GPixel/s
Texture Fill Rate
2.4 GTexel/s