33 MB
SDR150 MHz
Boost Clock250 nm
ProcessShare on Social Media
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Core Specifications
Architecture:
Fahrenheit
Process Size:
250 nm
Base Clock:
150 MHz
Boost Clock:
150 MHz
TMUs:
2
ROPs:
2
Memory & Performance
Memory Size:
33 MB
Memory Type:
SDR
Memory Bandwidth:
2.9 GB/s
Bus Interface:
AGP 4x
Suggested PSU:
200 W
Cache & Die Information
Die Size:
63 mm²
Transistors:
0.0 billion
Transistor Density:
0.2 million/mm²
Physical Specifications
Power Connectors:
None
Display Outputs:
1x VGA, 2x S-Video
Quick Facts
Performance
Pixel Fill Rate
0.3 GPixel/s
Texture Fill Rate
0.3 GTexel/s