3 GB
GDDR5574 MHz
Boost Clock900 W
TDP40 nm
ProcessShare on Social Media
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Core Specifications
Architecture:
Fermi
Process Size:
40 nm
Base Clock:
574 MHz
Boost Clock:
574 MHz
Shader Units:
448
SMs:
14
TMUs:
56
ROPs:
48
Memory & Performance
Memory Size:
3 GB
Memory Type:
GDDR5
Memory Bandwidth:
148.4 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
900 W
Suggested PSU:
1300 W
Cache & Die Information
L1 Cache:
64 KB
L2 Cache:
0.8 MB
Die Size:
529 mm²
Transistors:
3.1 billion
Transistor Density:
5.9 million/mm²
Quick Facts
Performance
Pixel Fill Rate
16.1 GPixel/s
Texture Fill Rate
32.1 GTexel/s
FP32 Performance
1.0 TFLOPS
CUDA Toolkit Compatibility
Cuda Compute
2.0
sm_20
Architecture
Fermi
Supported CUDA Toolkits
3.2
4.0
4.1
4.2
5.0
5.5
6.0
6.5
7.0
7.5
Note: Support dropped in CUDA 8.0
Fermi architecture (GF100/GF110) - Support dropped in CUDA 8.0