1200 MHz
Boost Clock15 W
TDP10 nm
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Core Specifications
Architecture:
Generation 12.2
Process Size:
10 nm
Base Clock:
300 MHz
Boost Clock:
1200 MHz
Shader Units:
192
TMUs:
12
ROPs:
6
Memory & Performance
Memory Type:
System Shared
Bus Interface:
Ring Bus
TDP:
15 W
Cache & Die Information
L2 Cache:
1.0 MB
Quick Facts
Performance
Pixel Fill Rate
7.2 GPixel/s
Texture Fill Rate
14.4 GTexel/s
FP32 Performance
0.5 TFLOPS