1300 MHz
Boost Clock15 W
TDP10 nm
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Core Specifications
Architecture:
Generation 12.2
Process Size:
10 nm
Base Clock:
300 MHz
Boost Clock:
1300 MHz
Shader Units:
128
TMUs:
8
ROPs:
8
Memory & Performance
Memory Type:
System Shared
Bus Interface:
Ring Bus
TDP:
15 W
Quick Facts
Performance
Pixel Fill Rate
10.4 GPixel/s
Texture Fill Rate
10.4 GTexel/s
FP32 Performance
0.3 TFLOPS