4 GB
LPDDR4X1550 MHz
Boost Clock30 W
TDP10 nm
ProcessShare on Social Media
Share Xe DG1 specifications with othersTechnical Specifications
Core Specifications
Architecture:
Generation 12.1
Process Size:
10 nm
Base Clock:
900 MHz
Boost Clock:
1550 MHz
Shader Units:
640
TMUs:
40
ROPs:
20
Memory & Performance
Memory Size:
4 GB
Memory Type:
LPDDR4X
Memory Bandwidth:
68.3 GB/s
Bus Interface:
PCIe 4.0 x8
TDP:
30 W
Suggested PSU:
200 W
Cache & Die Information
L2 Cache:
1.0 MB
Die Size:
95 mm²
Physical Specifications
Board Length:
164 mm
Board Width:
121 mm
Power Connectors:
None
Display Outputs:
1x HDMI, 3x DisplayPort
Quick Facts
Performance
Pixel Fill Rate
31.0 GPixel/s
Texture Fill Rate
62.0 GTexel/s
FP32 Performance
2.0 TFLOPS