6 GB
GDDR51100 MHz
Boost Clock300 W
TDP22 nm
ProcessShare on Social Media
Share Xeon Phi 3120A specifications with othersTechnical Specifications
Core Specifications
Architecture:
Knights
Process Size:
22 nm
Base Clock:
1100 MHz
Boost Clock:
1100 MHz
Shader Units:
912
TMUs:
32
Memory & Performance
Memory Size:
6 GB
Memory Type:
GDDR5
Memory Bandwidth:
240.0 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
300 W
Suggested PSU:
700 W
Cache & Die Information
Die Size:
720 mm²
Transistors:
5.0 billion
Transistor Density:
6.9 million/mm²
Physical Specifications
Board Length:
248 mm
Quick Facts
Performance
Texture Fill Rate
35.2 GTexel/s
FP32 Performance
2.0 TFLOPS