2200 MHz
Boost Clock35 W
TDP5 nm
ProcessShare on Social Media
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Core Specifications
Architecture:
Xe+
Process Size:
5 nm
Base Clock:
300 MHz
Boost Clock:
2200 MHz
Shader Units:
896
RT Cores:
7
TMUs:
56
ROPs:
28
Memory & Performance
Memory Type:
System Shared
Bus Interface:
PCIe 4.0 x8
TDP:
35 W
Cache & Die Information
L2 Cache:
4.0 MB
Quick Facts
Performance
Pixel Fill Rate
61.6 GPixel/s
Texture Fill Rate
123.2 GTexel/s
FP32 Performance
3.9 TFLOPS