2350 MHz
Boost Clock35 W
TDP5 nm
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Core Specifications
Architecture:
Xe+
Process Size:
5 nm
Base Clock:
300 MHz
Boost Clock:
2350 MHz
Shader Units:
1024
RT Cores:
8
TMUs:
64
ROPs:
32
Memory & Performance
Memory Type:
System Shared
Bus Interface:
PCIe 4.0 x8
TDP:
35 W
Cache & Die Information
L2 Cache:
4.0 MB
Quick Facts
Performance
Pixel Fill Rate
75.2 GPixel/s
Texture Fill Rate
150.4 GTexel/s
FP32 Performance
4.8 TFLOPS