1850 MHz
Boost Clock37 W
TDP3 nm
ProcessShare on Social Media
Share Arc 130V Mobile specifications with othersTechnical Specifications
Core Specifications
Architecture:
Xe2-LPG
Process Size:
3 nm
Base Clock:
300 MHz
Boost Clock:
1850 MHz
Shader Units:
896
RT Cores:
7
TMUs:
56
ROPs:
28
Memory & Performance
Memory Type:
System Shared
Bus Interface:
PCIe 4.0 x8
TDP:
37 W
Cache & Die Information
L2 Cache:
4.0 MB
Die Size:
172 mm²
Quick Facts
Performance
Pixel Fill Rate
51.8 GPixel/s
Texture Fill Rate
103.6 GTexel/s
FP32 Performance
3.3 TFLOPS