1950 MHz
Boost Clock37 W
TDP3 nm
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Core Specifications
Architecture:
Xe2-LPG
Process Size:
3 nm
Base Clock:
300 MHz
Boost Clock:
1950 MHz
Shader Units:
1024
RT Cores:
8
TMUs:
64
ROPs:
32
Memory & Performance
Memory Type:
System Shared
Bus Interface:
PCIe 4.0 x8
TDP:
37 W
Cache & Die Information
L2 Cache:
4.0 MB
Die Size:
172 mm²
Quick Facts
Performance
Pixel Fill Rate
62.4 GPixel/s
Texture Fill Rate
124.8 GTexel/s
FP32 Performance
4.0 TFLOPS