48 GB
HBM2e1550 MHz
Boost Clock300 W
TDP10 nm
ProcessShare on Social Media
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Core Specifications
Architecture:
Generation 12.5
Process Size:
10 nm
Base Clock:
1000 MHz
Boost Clock:
1550 MHz
Shader Units:
7168
RT Cores:
56
TMUs:
448
Memory & Performance
Memory Size:
48 GB
Memory Type:
HBM2e
Memory Bandwidth:
1230.0 GB/s
Bus Interface:
PCIe 5.0 x16
TDP:
300 W
Suggested PSU:
700 W
Cache & Die Information
L1 Cache:
64 KB
L2 Cache:
204.0 MB
Die Size:
1280 mm²
Transistors:
100.0 billion
Transistor Density:
78.1 million/mm²
Physical Specifications
Board Length:
267 mm
Power Connectors:
1x 12-pin
Quick Facts
Performance
Texture Fill Rate
694.4 GTexel/s
FP32 Performance
22.2 TFLOPS