128 GB
HBM2e1600 MHz
Boost Clock600 W
TDP10 nm
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Core Specifications
Architecture:
Generation 12.5
Process Size:
10 nm
Base Clock:
900 MHz
Boost Clock:
1600 MHz
Shader Units:
16384
RT Cores:
128
TMUs:
1024
Memory & Performance
Memory Size:
128 GB
Memory Type:
HBM2e
Memory Bandwidth:
3280.0 GB/s
Bus Interface:
PCIe 5.0 x16
TDP:
600 W
Suggested PSU:
1000 W
Cache & Die Information
L1 Cache:
64 KB
L2 Cache:
408.0 MB
Die Size:
1280 mm²
Transistors:
100.0 billion
Transistor Density:
78.1 million/mm²
Quick Facts
Performance
Texture Fill Rate
1638.4 GTexel/s
FP32 Performance
52.4 TFLOPS