256 MB
DDR3400 MHz
Boost Clock32 W
TDP55 nm
ProcessShare on Social Media
Share FirePro 2450 Multi-View PCIe x1 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale
Process Size:
55 nm
Base Clock:
400 MHz
Boost Clock:
400 MHz
Shader Units:
40
TMUs:
4
ROPs:
4
Memory & Performance
Memory Size:
256 MB
Memory Type:
DDR3
Memory Bandwidth:
6.4 GB/s
Bus Interface:
PCIe 2.0 x1
TDP:
32 W
Suggested PSU:
200 W
Cache & Die Information
Die Size:
67 mm²
Transistors:
0.2 billion
Transistor Density:
2.7 million/mm²
Physical Specifications
Board Length:
170 mm
Board Width:
69 mm
Power Connectors:
None
Display Outputs:
1x VHDCI
Quick Facts
Performance
Pixel Fill Rate
1.6 GPixel/s
Texture Fill Rate
1.6 GTexel/s
FP32 Performance
0.0 TFLOPS