512 MB
DDR3500 MHz
Boost Clock17 W
TDP40 nm
ProcessShare on Social Media
Share FirePro 2460 Multi-View specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale 2
Process Size:
40 nm
Base Clock:
500 MHz
Boost Clock:
500 MHz
Shader Units:
80
TMUs:
8
ROPs:
4
Memory & Performance
Memory Size:
512 MB
Memory Type:
DDR3
Memory Bandwidth:
32.0 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
17 W
Suggested PSU:
200 W
Cache & Die Information
Die Size:
59 mm²
Transistors:
0.3 billion
Transistor Density:
4.9 million/mm²
Physical Specifications
Board Length:
170 mm
Board Width:
69 mm
Power Connectors:
None
Display Outputs:
4x mini-DisplayPort 1.1
Quick Facts
Performance
Pixel Fill Rate
2.0 GPixel/s
Texture Fill Rate
4.0 GTexel/s
FP32 Performance
0.1 TFLOPS