2 GB
GDDR5850 MHz
Boost Clock150 W
TDP28 nm
ProcessShare on Social Media
Share FirePro D300 specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 1.0
Process Size:
28 nm
Base Clock:
850 MHz
Boost Clock:
850 MHz
Shader Units:
1280
TMUs:
80
ROPs:
32
Memory & Performance
Memory Size:
2 GB
Memory Type:
GDDR5
Memory Bandwidth:
162.6 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
150 W
Suggested PSU:
450 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.5 MB
Die Size:
212 mm²
Transistors:
2.8 billion
Transistor Density:
13.2 million/mm²
Physical Specifications
Board Length:
242 mm
Display Outputs:
4x DisplayPort 1.2
Quick Facts
Performance
Pixel Fill Rate
27.2 GPixel/s
Texture Fill Rate
68.0 GTexel/s
FP32 Performance
2.2 TFLOPS