3 GB
GDDR5725 MHz
Boost Clock274 W
TDP28 nm
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Share FirePro D500 specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 1.0
Process Size:
28 nm
Base Clock:
725 MHz
Boost Clock:
725 MHz
Shader Units:
1536
TMUs:
96
ROPs:
32
Memory & Performance
Memory Size:
3 GB
Memory Type:
GDDR5
Memory Bandwidth:
243.8 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
274 W
Suggested PSU:
600 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.8 MB
Die Size:
352 mm²
Transistors:
4.3 billion
Transistor Density:
12.3 million/mm²
Physical Specifications
Board Length:
279 mm
Display Outputs:
6x mini-DisplayPort 1.2, 1x SDI
Quick Facts
Performance
Pixel Fill Rate
23.2 GPixel/s
Texture Fill Rate
69.6 GTexel/s
FP32 Performance
2.2 TFLOPS