3 GB
GDDR5950 MHz
Boost Clock375 W
TDP28 nm
ProcessShare on Social Media
Share FirePro S10000 Passive specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 1.0
Process Size:
28 nm
Base Clock:
825 MHz
Boost Clock:
950 MHz
Shader Units:
1792
TMUs:
112
ROPs:
32
Memory & Performance
Memory Size:
3 GB
Memory Type:
GDDR5
Memory Bandwidth:
240.0 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
375 W
Suggested PSU:
750 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.8 MB
Die Size:
352 mm²
Transistors:
4.3 billion
Transistor Density:
12.3 million/mm²
Physical Specifications
Board Length:
305 mm
Board Width:
111 mm
Power Connectors:
2x 8-pin
Display Outputs:
1x DVI, 1x mini-DisplayPort 1.2
Quick Facts
Performance
Pixel Fill Rate
30.4 GPixel/s
Texture Fill Rate
106.4 GTexel/s
FP32 Performance
3.4 TFLOPS