12 GB
GDDR5900 MHz
Boost Clock225 W
TDP28 nm
ProcessShare on Social Media
Share FirePro S9050 specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 1.0
Process Size:
28 nm
Base Clock:
900 MHz
Boost Clock:
900 MHz
Shader Units:
1792
TMUs:
112
ROPs:
32
Memory & Performance
Memory Size:
12 GB
Memory Type:
GDDR5
Memory Bandwidth:
264.0 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
225 W
Suggested PSU:
550 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.8 MB
Die Size:
352 mm²
Transistors:
4.3 billion
Transistor Density:
12.3 million/mm²
Physical Specifications
Board Length:
254 mm
Board Width:
111 mm
Power Connectors:
1x 8-pin
Display Outputs:
1x DisplayPort 1.2
Quick Facts
Performance
Pixel Fill Rate
28.8 GPixel/s
Texture Fill Rate
100.8 GTexel/s
FP32 Performance
3.2 TFLOPS