8 GB
GDDR5920 MHz
Boost Clock265 W
TDP28 nm
ProcessShare on Social Media
Share FirePro S7150 x2 specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 3.0
Process Size:
28 nm
Base Clock:
920 MHz
Boost Clock:
920 MHz
Shader Units:
1792
TMUs:
112
ROPs:
32
Memory & Performance
Memory Size:
8 GB
Memory Type:
GDDR5
Memory Bandwidth:
160.0 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
265 W
Suggested PSU:
600 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.5 MB
Die Size:
366 mm²
Transistors:
5.0 billion
Transistor Density:
13.7 million/mm²
Physical Specifications
Board Length:
241 mm
Board Width:
111 mm
Power Connectors:
1x 6-pin + 1x 8-pin
Quick Facts
Performance
Pixel Fill Rate
29.4 GPixel/s
Texture Fill Rate
103.0 GTexel/s
FP32 Performance
3.3 TFLOPS