32 GB
GDDR5930 MHz
Boost Clock275 W
TDP28 nm
ProcessShare on Social Media
Share FirePro S9170 specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 2.0
Process Size:
28 nm
Base Clock:
930 MHz
Boost Clock:
930 MHz
Shader Units:
2816
TMUs:
176
ROPs:
64
Memory & Performance
Memory Size:
32 GB
Memory Type:
GDDR5
Memory Bandwidth:
320.0 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
275 W
Suggested PSU:
600 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
1.0 MB
Die Size:
438 mm²
Transistors:
6.2 billion
Transistor Density:
14.2 million/mm²
Physical Specifications
Board Length:
267 mm
Board Width:
111 mm
Power Connectors:
1x 6-pin + 1x 8-pin
Quick Facts
Performance
Pixel Fill Rate
59.5 GPixel/s
Texture Fill Rate
163.7 GTexel/s
FP32 Performance
5.2 TFLOPS