4 GB
HBM975 MHz
Boost Clock300 W
TDP28 nm
ProcessShare on Social Media
Share FirePro S9300 X2 specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 3.0
Process Size:
28 nm
Base Clock:
975 MHz
Boost Clock:
975 MHz
Shader Units:
4096
TMUs:
256
ROPs:
64
Memory & Performance
Memory Size:
4 GB
Memory Type:
HBM
Memory Bandwidth:
512.0 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
300 W
Suggested PSU:
700 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
2.0 MB
Die Size:
596 mm²
Transistors:
8.9 billion
Transistor Density:
14.9 million/mm²
Physical Specifications
Board Length:
267 mm
Board Width:
111 mm
Power Connectors:
2x 8-pin
Quick Facts
Performance
Pixel Fill Rate
62.4 GPixel/s
Texture Fill Rate
249.6 GTexel/s
FP32 Performance
8.0 TFLOPS