2 GB
DDR3680 MHz
Boost Clock26 W
TDP28 nm
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Share FirePro W2100 specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 1.0
Process Size:
28 nm
Base Clock:
630 MHz
Boost Clock:
680 MHz
Shader Units:
320
TMUs:
20
ROPs:
8
Memory & Performance
Memory Size:
2 GB
Memory Type:
DDR3
Memory Bandwidth:
28.8 GB/s
Bus Interface:
PCIe 3.0 x8
TDP:
26 W
Suggested PSU:
200 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.2 MB
Die Size:
77 mm²
Transistors:
0.9 billion
Transistor Density:
12.3 million/mm²
Physical Specifications
Board Length:
168 mm
Board Width:
69 mm
Power Connectors:
None
Display Outputs:
2x DisplayPort 1.2
Quick Facts
Performance
Pixel Fill Rate
5.4 GPixel/s
Texture Fill Rate
13.6 GTexel/s
FP32 Performance
0.4 TFLOPS