8 GB
GDDR5824 MHz
Boost Clock220 W
TDP28 nm
ProcessShare on Social Media
Share FirePro W8100 specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 2.0
Process Size:
28 nm
Base Clock:
824 MHz
Boost Clock:
824 MHz
Shader Units:
2560
TMUs:
160
ROPs:
64
Memory & Performance
Memory Size:
8 GB
Memory Type:
GDDR5
Memory Bandwidth:
320.0 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
220 W
Suggested PSU:
550 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
1.0 MB
Die Size:
438 mm²
Transistors:
6.2 billion
Transistor Density:
14.2 million/mm²
Physical Specifications
Board Length:
279 mm
Board Width:
111 mm
Power Connectors:
2x 6-pin
Display Outputs:
4x DisplayPort 1.2, 1x SDI
Quick Facts
Performance
Pixel Fill Rate
52.7 GPixel/s
Texture Fill Rate
131.8 GTexel/s
FP32 Performance
4.2 TFLOPS