4 GB
GDDR51075 MHz
Boost Clock28 nm
ProcessShare on Social Media
Share FirePro W6150M specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 2.0
Process Size:
28 nm
Base Clock:
1075 MHz
Boost Clock:
1075 MHz
Shader Units:
768
TMUs:
48
ROPs:
16
Memory & Performance
Memory Size:
4 GB
Memory Type:
GDDR5
Memory Bandwidth:
88.0 GB/s
Bus Interface:
MXM-B (3.0)
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.2 MB
Die Size:
160 mm²
Transistors:
2.1 billion
Transistor Density:
13.0 million/mm²
Physical Specifications
Power Connectors:
None
Quick Facts
Performance
Pixel Fill Rate
17.2 GPixel/s
Texture Fill Rate
51.6 GTexel/s
FP32 Performance
1.7 TFLOPS