4 GB
GDDR5723 MHz
Boost Clock100 W
TDP28 nm
ProcessShare on Social Media
Share FirePro W7170M specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 3.0
Process Size:
28 nm
Base Clock:
723 MHz
Boost Clock:
723 MHz
Shader Units:
2048
TMUs:
128
ROPs:
32
Memory & Performance
Memory Size:
4 GB
Memory Type:
GDDR5
Memory Bandwidth:
160.0 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
100 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.5 MB
Die Size:
366 mm²
Transistors:
5.0 billion
Transistor Density:
13.7 million/mm²
Physical Specifications
Power Connectors:
None
Quick Facts
Performance
Pixel Fill Rate
23.1 GPixel/s
Texture Fill Rate
92.5 GTexel/s
FP32 Performance
3.0 TFLOPS