2 GB
DDR31021 MHz
Boost Clock50 W
TDP28 nm
ProcessShare on Social Media
Share Radeon 530 Mobile DDR3 specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 3.0
Process Size:
28 nm
Base Clock:
730 MHz
Boost Clock:
1021 MHz
Shader Units:
384
TMUs:
24
ROPs:
8
Memory & Performance
Memory Size:
2 GB
Memory Type:
DDR3
Memory Bandwidth:
14.4 GB/s
Bus Interface:
PCIe 3.0 x8
TDP:
50 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.1 MB
Die Size:
125 mm²
Transistors:
1.6 billion
Transistor Density:
12.4 million/mm²
Physical Specifications
Power Connectors:
None
Quick Facts
Performance
Pixel Fill Rate
8.2 GPixel/s
Texture Fill Rate
24.5 GTexel/s
FP32 Performance
0.8 TFLOPS