2200 MHz
Boost Clock15 W
TDP5 nm
ProcessShare on Social Media
Share Radeon 610M specifications with othersTechnical Specifications
Core Specifications
Architecture:
RDNA 2.0
Process Size:
5 nm
Base Clock:
400 MHz
Boost Clock:
2200 MHz
Shader Units:
128
RT Cores:
2
TMUs:
8
ROPs:
4
Memory & Performance
Memory Type:
System Shared
Bus Interface:
PCIe 4.0 x8
TDP:
15 W
Cache & Die Information
L1 Cache:
128 KB
L2 Cache:
2.0 MB
Die Size:
264 mm²
Physical Specifications
Power Connectors:
None
Quick Facts
Performance
Pixel Fill Rate
8.8 GPixel/s
Texture Fill Rate
17.6 GTexel/s
FP32 Performance
0.6 TFLOPS