2800 MHz
Boost Clock45 W
TDP4 nm
ProcessShare on Social Media
Share Radeon 740M specifications with othersTechnical Specifications
Core Specifications
Architecture:
RDNA 3.0
Process Size:
4 nm
Base Clock:
800 MHz
Boost Clock:
2800 MHz
Shader Units:
256
RT Cores:
4
TMUs:
16
ROPs:
8
Memory & Performance
Memory Type:
System Shared
Bus Interface:
PCIe 4.0 x8
TDP:
45 W
Cache & Die Information
L1 Cache:
128 KB
L2 Cache:
2.0 MB
Die Size:
137 mm²
Transistors:
20.9 billion
Transistor Density:
152.6 million/mm²
Physical Specifications
Power Connectors:
None
Quick Facts
Performance
Pixel Fill Rate
22.4 GPixel/s
Texture Fill Rate
44.8 GTexel/s
FP32 Performance
2.9 TFLOPS