2599 MHz
Boost Clock15 W
TDP4 nm
ProcessShare on Social Media
Share Radeon 760M specifications with othersTechnical Specifications
Core Specifications
Architecture:
RDNA 3.0
Process Size:
4 nm
Base Clock:
800 MHz
Boost Clock:
2599 MHz
Shader Units:
512
RT Cores:
8
TMUs:
32
ROPs:
16
Memory & Performance
Memory Type:
System Shared
Bus Interface:
PCIe 4.0 x8
TDP:
15 W
Cache & Die Information
L1 Cache:
128 KB
L2 Cache:
2.0 MB
Die Size:
178 mm²
Transistors:
25.4 billion
Transistor Density:
142.6 million/mm²
Physical Specifications
Power Connectors:
None
Quick Facts
Performance
Pixel Fill Rate
41.6 GPixel/s
Texture Fill Rate
83.2 GTexel/s
FP32 Performance
5.3 TFLOPS