3000 MHz
Boost Clock15 W
TDP4 nm
ProcessShare on Social Media
Share Radeon 860M specifications with othersTechnical Specifications
Core Specifications
Architecture:
RDNA 3.5
Process Size:
4 nm
Base Clock:
600 MHz
Boost Clock:
3000 MHz
Shader Units:
512
RT Cores:
8
TMUs:
32
ROPs:
8
Memory & Performance
Memory Type:
System Shared
Bus Interface:
PCIe 4.0 x8
TDP:
15 W
Cache & Die Information
L1 Cache:
128 KB
L2 Cache:
1.0 MB
Physical Specifications
Power Connectors:
None
Quick Facts
Performance
Pixel Fill Rate
24.0 GPixel/s
Texture Fill Rate
96.0 GTexel/s
FP32 Performance
3.1 TFLOPS