2900 MHz
Boost Clock15 W
TDP4 nm
ProcessShare on Social Media
Share Radeon 890M specifications with othersTechnical Specifications
Core Specifications
Architecture:
RDNA 3.5
Process Size:
4 nm
Base Clock:
400 MHz
Boost Clock:
2900 MHz
Shader Units:
1024
RT Cores:
16
TMUs:
64
ROPs:
32
Memory & Performance
Memory Type:
System Shared
Bus Interface:
PCIe 4.0 x8
TDP:
15 W
Cache & Die Information
L1 Cache:
128 KB
L2 Cache:
2.0 MB
Die Size:
233 mm²
Transistors:
34.0 billion
Transistor Density:
145.9 million/mm²
Physical Specifications
Power Connectors:
None
Quick Facts
Performance
Pixel Fill Rate
92.8 GPixel/s
Texture Fill Rate
185.6 GTexel/s
FP32 Performance
5.9 TFLOPS