512 MB
GDDR3825 MHz
Boost Clock165 W
TDP55 nm
ProcessShare on Social Media
Share Radeon HD 3870 X2 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale
Process Size:
55 nm
Base Clock:
825 MHz
Boost Clock:
825 MHz
Shader Units:
320
TMUs:
16
ROPs:
16
Memory & Performance
Memory Size:
512 MB
Memory Type:
GDDR3
Memory Bandwidth:
57.7 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
165 W
Suggested PSU:
450 W
Cache & Die Information
L2 Cache:
0.2 MB
Die Size:
192 mm²
Transistors:
0.7 billion
Transistor Density:
3.5 million/mm²
Physical Specifications
Board Length:
267 mm
Board Width:
113 mm
Power Connectors:
1x 6-pin + 1x 8-pin
Display Outputs:
2x DVI, 1x S-Video
Quick Facts
Performance
Pixel Fill Rate
13.2 GPixel/s
Texture Fill Rate
13.2 GTexel/s
FP32 Performance
0.5 TFLOPS