512 MB
GDDR3575 MHz
Boost Clock95 W
TDP55 nm
ProcessShare on Social Media
Share Radeon HD 4830 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale
Process Size:
55 nm
Base Clock:
575 MHz
Boost Clock:
575 MHz
Shader Units:
640
TMUs:
32
ROPs:
16
Memory & Performance
Memory Size:
512 MB
Memory Type:
GDDR3
Memory Bandwidth:
57.6 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
95 W
Suggested PSU:
250 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.2 MB
Die Size:
256 mm²
Transistors:
1.0 billion
Transistor Density:
3.7 million/mm²
Physical Specifications
Board Length:
246 mm
Board Width:
111 mm
Power Connectors:
1x 6-pin
Display Outputs:
2x DVI, 1x S-Video
Quick Facts
Performance
Pixel Fill Rate
9.2 GPixel/s
Texture Fill Rate
18.4 GTexel/s
FP32 Performance
0.7 TFLOPS