512 MB
GDDR3625 MHz
Boost Clock250 W
TDP55 nm
ProcessShare on Social Media
Share Radeon HD 4850 X2 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale
Process Size:
55 nm
Base Clock:
625 MHz
Boost Clock:
625 MHz
Shader Units:
800
TMUs:
40
ROPs:
16
Memory & Performance
Memory Size:
512 MB
Memory Type:
GDDR3
Memory Bandwidth:
63.7 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
250 W
Suggested PSU:
600 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.2 MB
Die Size:
256 mm²
Transistors:
1.0 billion
Transistor Density:
3.7 million/mm²
Physical Specifications
Board Length:
267 mm
Power Connectors:
1x 6-pin + 1x 8-pin
Display Outputs:
4x DVI, 1x S-Video
Quick Facts
Performance
Pixel Fill Rate
10.0 GPixel/s
Texture Fill Rate
25.0 GTexel/s
FP32 Performance
1.0 TFLOPS