1 GB
GDDR3650 MHz
Boost Clock50 W
TDP40 nm
ProcessShare on Social Media
Share FirePro V3900 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale 2
Process Size:
40 nm
Base Clock:
650 MHz
Boost Clock:
650 MHz
Shader Units:
480
TMUs:
24
ROPs:
8
Memory & Performance
Memory Size:
1 GB
Memory Type:
GDDR3
Memory Bandwidth:
28.8 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
50 W
Suggested PSU:
250 W
Cache & Die Information
L1 Cache:
8 KB
L2 Cache:
0.2 MB
Die Size:
118 mm²
Transistors:
0.7 billion
Transistor Density:
6.1 million/mm²
Physical Specifications
Board Length:
168 mm
Board Width:
69 mm
Power Connectors:
None
Display Outputs:
1x DVI, 1x DisplayPort 1.1
Quick Facts
Performance
Pixel Fill Rate
5.2 GPixel/s
Texture Fill Rate
15.6 GTexel/s
FP32 Performance
0.6 TFLOPS