2 GB
GDDR5725 MHz
Boost Clock150 W
TDP40 nm
ProcessShare on Social Media
Share FirePro V7900 SDI specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale 3
Process Size:
40 nm
Base Clock:
725 MHz
Boost Clock:
725 MHz
Shader Units:
1280
TMUs:
80
ROPs:
32
Memory & Performance
Memory Size:
2 GB
Memory Type:
GDDR5
Memory Bandwidth:
160.0 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
150 W
Suggested PSU:
450 W
Cache & Die Information
L1 Cache:
8 KB
L2 Cache:
0.5 MB
Die Size:
389 mm²
Transistors:
2.6 billion
Transistor Density:
6.8 million/mm²
Physical Specifications
Board Length:
279 mm
Board Width:
111 mm
Power Connectors:
1x 6-pin
Display Outputs:
4x DisplayPort 1.2, 1x SDI
Quick Facts
Performance
Pixel Fill Rate
23.2 GPixel/s
Texture Fill Rate
58.0 GTexel/s
FP32 Performance
1.9 TFLOPS