2 GB
GDDR5600 MHz
Boost Clock75 W
TDP40 nm
ProcessShare on Social Media
Share FirePro V5900 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale 3
Process Size:
40 nm
Base Clock:
600 MHz
Boost Clock:
600 MHz
Shader Units:
512
TMUs:
32
ROPs:
32
Memory & Performance
Memory Size:
2 GB
Memory Type:
GDDR5
Memory Bandwidth:
64.0 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
75 W
Suggested PSU:
250 W
Cache & Die Information
L1 Cache:
8 KB
L2 Cache:
0.5 MB
Die Size:
389 mm²
Transistors:
2.6 billion
Transistor Density:
6.8 million/mm²
Physical Specifications
Board Length:
229 mm
Board Width:
112 mm
Power Connectors:
None
Display Outputs:
1x DVI, 2x DisplayPort 1.2
Quick Facts
Performance
Pixel Fill Rate
19.2 GPixel/s
Texture Fill Rate
19.2 GTexel/s
FP32 Performance
0.6 TFLOPS