2 GB
GDDR5825 MHz
Boost Clock75 W
TDP28 nm
ProcessShare on Social Media
Share FirePro W5000 specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 1.0
Process Size:
28 nm
Base Clock:
825 MHz
Boost Clock:
825 MHz
Shader Units:
768
TMUs:
48
ROPs:
32
Memory & Performance
Memory Size:
2 GB
Memory Type:
GDDR5
Memory Bandwidth:
102.4 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
75 W
Suggested PSU:
250 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.5 MB
Die Size:
212 mm²
Transistors:
2.8 billion
Transistor Density:
13.2 million/mm²
Physical Specifications
Board Length:
183 mm
Board Width:
111 mm
Power Connectors:
None
Display Outputs:
1x DVI, 2x DisplayPort 1.2
Quick Facts
Performance
Pixel Fill Rate
26.4 GPixel/s
Texture Fill Rate
39.6 GTexel/s
FP32 Performance
1.3 TFLOPS