2 GB
GDDR5750 MHz
Boost Clock75 W
TDP28 nm
ProcessShare on Social Media
Share FirePro W600 specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 1.0
Process Size:
28 nm
Base Clock:
750 MHz
Boost Clock:
750 MHz
Shader Units:
512
TMUs:
32
ROPs:
16
Memory & Performance
Memory Size:
2 GB
Memory Type:
GDDR5
Memory Bandwidth:
64.0 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
75 W
Suggested PSU:
250 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.2 MB
Die Size:
123 mm²
Transistors:
1.5 billion
Transistor Density:
12.2 million/mm²
Physical Specifications
Board Length:
168 mm
Board Width:
111 mm
Power Connectors:
None
Display Outputs:
6x mini-DisplayPort 1.2
Quick Facts
Performance
Pixel Fill Rate
12.0 GPixel/s
Texture Fill Rate
24.0 GTexel/s
FP32 Performance
0.8 TFLOPS