6 GB
GDDR5975 MHz
Boost Clock274 W
TDP28 nm
ProcessShare on Social Media
Share FirePro W9000 specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 1.0
Process Size:
28 nm
Base Clock:
975 MHz
Boost Clock:
975 MHz
Shader Units:
2048
TMUs:
128
ROPs:
32
Memory & Performance
Memory Size:
6 GB
Memory Type:
GDDR5
Memory Bandwidth:
264.0 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
274 W
Suggested PSU:
600 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.8 MB
Die Size:
352 mm²
Transistors:
4.3 billion
Transistor Density:
12.3 million/mm²
Physical Specifications
Board Length:
279 mm
Board Width:
111 mm
Power Connectors:
1x 6-pin + 1x 8-pin
Display Outputs:
6x mini-DisplayPort 1.2, 1x SDI
Quick Facts
Performance
Pixel Fill Rate
31.2 GPixel/s
Texture Fill Rate
124.8 GTexel/s
FP32 Performance
4.0 TFLOPS