1 GB
GDDR5850 MHz
Boost Clock190 W
TDP55 nm
ProcessShare on Social Media
Share Radeon HD 4890 specifications with othersTechnical Specifications
Core Specifications
Architecture:
TeraScale
Process Size:
55 nm
Base Clock:
850 MHz
Boost Clock:
850 MHz
Shader Units:
800
TMUs:
40
ROPs:
16
Memory & Performance
Memory Size:
1 GB
Memory Type:
GDDR5
Memory Bandwidth:
124.8 GB/s
Bus Interface:
PCIe 2.0 x16
TDP:
190 W
Suggested PSU:
450 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
0.2 MB
Die Size:
282 mm²
Transistors:
1.0 billion
Transistor Density:
3.4 million/mm²
Physical Specifications
Board Length:
241 mm
Board Width:
111 mm
Power Connectors:
2x 6-pin
Display Outputs:
2x DVI, 1x S-Video
Quick Facts
Performance
Pixel Fill Rate
13.6 GPixel/s
Texture Fill Rate
34.0 GTexel/s
FP32 Performance
1.4 TFLOPS