32 GB
HBM21502 MHz
Boost Clock300 W
TDP7 nm
ProcessShare on Social Media
Share Radeon Instinct MI100 specifications with othersTechnical Specifications
Core Specifications
Architecture:
CDNA 1.0
Process Size:
7 nm
Base Clock:
1000 MHz
Boost Clock:
1502 MHz
Shader Units:
7680
TMUs:
480
ROPs:
64
Memory & Performance
Memory Size:
32 GB
Memory Type:
HBM2
Memory Bandwidth:
1230.0 GB/s
Bus Interface:
PCIe 4.0 x16
TDP:
300 W
Suggested PSU:
700 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
8.0 MB
Die Size:
750 mm²
Transistors:
25.6 billion
Transistor Density:
34.1 million/mm²
Physical Specifications
Board Length:
267 mm
Board Width:
111 mm
Power Connectors:
2x 8-pin
Quick Facts
Performance
Pixel Fill Rate
96.1 GPixel/s
Texture Fill Rate
721.0 GTexel/s
FP32 Performance
23.1 TFLOPS