16 GB
HBM21500 MHz
Boost Clock300 W
TDP14 nm
ProcessShare on Social Media
Share Radeon Instinct MI25 specifications with othersTechnical Specifications
Core Specifications
Architecture:
GCN 5.0
Process Size:
14 nm
Base Clock:
1400 MHz
Boost Clock:
1500 MHz
Shader Units:
4096
TMUs:
256
ROPs:
64
Memory & Performance
Memory Size:
16 GB
Memory Type:
HBM2
Memory Bandwidth:
436.2 GB/s
Bus Interface:
PCIe 3.0 x16
TDP:
300 W
Suggested PSU:
700 W
Cache & Die Information
L1 Cache:
16 KB
L2 Cache:
4.0 MB
Die Size:
495 mm²
Transistors:
12.5 billion
Transistor Density:
25.3 million/mm²
Physical Specifications
Board Length:
267 mm
Board Width:
111 mm
Power Connectors:
2x 8-pin
Quick Facts
Performance
Pixel Fill Rate
96.0 GPixel/s
Texture Fill Rate
384.0 GTexel/s
FP32 Performance
12.3 TFLOPS